Fiera Milano launches niche e-commerce packaging show in Shanghai

Shanghai, 23rd September: Next month, Fiera Milano will launch a new event serving the e-commerce packaging sector in China. E-PACK TECH by Ipack Ima will be held from 23rd to 26th October 2019 at Shanghai New International Expo Centre (SNIEC).

Organised by Hannover Milano Fairs Shanghai, a Chinese joint venture between Deutsche Messe and Fiera Milano, the new show will feature packaging technologies and solutions designed for the e-commerce market.

The inaugural E-PACK TECH by Ipack Ima will take place within CeMAT Asia, a leading exhibition focused on logistics, technological automation, transport and handling systems in China. CeMAT Asia 2018 featured 630 exhibitors covering an exhibition area of nearly 70,000 m2 attracting more than 100,000 visitors.

 

Source: Fiera Milano press release